50W 5730 LED Board PCB Assembly
Causes of PCBA failure
PCBA assembly is made of iron lead foot components. Due to the lack of solder material covering, iron quickly produces Fe3+ under the corrosion of halogen ions and moisture, which makes the board red.
In addition, in humid environments, acidic ionic pollutants can directly corrode copper leads, solders and components, leading to circuit failure.
2. Electric migration
If there is ion pollution on the surface of PCBA, the phenomenon of electric migration will easily occur, and the ionized metal will move to opposite electrodes, and the dendrite will be reduced to the original metal at the reverse end, and then the dendrite distribution (dendrite, dendrite, tin whisker) will appear. The growth of dendrite may cause short circuit.
3. Poor electrical contact
In the process of PCBA assembly, some resins, such as rosin residues, often contaminate gold fingers or other connectors. When PCBA is hot, residues are sticky and easy to absorb dust or impurities, leading to increased contact resistance and even failure of open circuit. The corrosion of nickel layer of PCB surface solder pan in BGA solder spot and the existence of phosphor layer on nickel layer surface reduce the mechanical bonding strength of solder joint and pad.
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