Through hole in the PCB board is used to connect the circuit lines of PCB two sides, or connect any interlayer line for multilayer PCB.To make the holes be conductive, it is necessary to plate the holewall with metal layer after drilling.Now, traditional mechanical method has been unable to meet requirements of the hole diameter smaller and smaller: although improve the spindle speed, the radial drilling tool rate will be decreased due to diameter too small, even can't meet requested processing effect.In addition, it is also a limited factor to consider worn tool consumables easily from the economic perspective.
When drilling holes, the laser can cut since the hole center to make a microporous contour, which is more accurate than normal method.The system can drill the minimum diameter of 20um on organic or non-organic PCB in the case of high diameter depth ratio.All the flexible PCB, IC PCB boards, or HDI PCB boards require such precision.
In the manufacturing process of electronic components, which conditions are required to cut pregreg material? In early stages, the pregreg material has been applied in multilayer PCB circuit boards.Each circuit layer of the multi-layer PCB are laminated together by the prepreg effect.According to the circuit design, the prepreg in some regions need to be cut and open in advance and then laminated together.
The laser process can form an accurate outline on sensitive overlays.Similar processes can be applied to FPC overlay films.The film usually consists of polyimide and glue layer thickness of 25um or 12.5um,but easy to deform.A single area (such as one pad) does not cover overlay films to make later assembly, connection and other work easily.
This thin material is very sensitive to mechanical stress--it can be done easily with non-contact laser processing.At the same time, the vacuum adsorption table can fix its position well and maintain its flatness.
Rigid-flex PCB processing
For rigid-flex PCB, laminate rigid PCB and flexible PCB to form a multilayer PCB.During lamination process, the flexible PCB isn't bonded together with rigid PCB, through laser cutting depth, cover and separate the lid on flex PCB, and leave the flexible part, forming a rigid-flex PCB. Such processing is also applicable to the blind groove processing of the surface embedded integrated components for multilayer PCB.The UV laser will precisely cut the blind slot in the target layer separated from the multilayer circuit board. In this region, the target layer can not be connected to the material covered above.
PCB and FPC are cut with highly efficient
Cut the board after be SMT is to cut the PCB installed with multiple electronic components, which is at the end of the production chain. To split boards, different techniques can be selected: for common PCB, traditional knife cutting, punching and contour milling are preferred.For complex electronic circuits and thin PCB, especially when be sensitive to mechanical stress, dust and size deviation, the UV laser cutting board has more advantage.
Due to the short wavelength of UV laser, most materials can be processed.For example, it can be used in electronics industry field:
Processing TCO/ITO glass with no damage to the base
Drilling holes in flexible or thin material
Rigid/flexible printed circuit board
Precision cutting LTCC
Repair for PCB with SMT or not
The solder mask layer or cover film opening
Cut sintering ceramics
UV laser processing application in PCB industry
Not only be used in of PCB boards processing, the UV laser system can also complete cutting, direct writing and LTCC components drilling in the same time during one processing operation.