1. Strictly implement the first inspection system to ensure that the product size meets the design requirements;
2. According to the circuit board raw materials, reasonable choice milling process parameters;
3. Fixed the position of the circuit board, should carefully clamp, lest damage circuit board surface solder layer and solder resistance layer;
4. In ensuring the consistency of the substrate dimensions, the position accuracy must be strictly controlled;
5. In the disassembly, to pay special attention to the substrate when the base layer pad paper to avoid damage circuit board surface plating coating layer.