One-stop EMS service-----Your reliable PCB and PCB Assembly Supplier
| PCB Assembly Specifications | ||
| Quantity | Prototype and small to middle volume are our specialty | |
| Type of Assembly | SMT and Thru-hole | |
| Type of Service | Turn-Key, Partial Turn-Key or Consignment | |
| Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free | |
| File Formats | Bill of Materials | |
| Gerber Files | ||
| Pick-N-Place File (XYRS) | ||
| Bare Board Size | Smallest: 0.25 x 0.25 Inches | |
| Largest: 20 x 20 Inches | ||
| Components | Passives Down to 0201 Size | |
| BGA and VFBGA | ||
| Leadless Chip Carriers/ CSP | ||
| Double-Sided SMT Assembly | ||
| BGA Repair and Reball | ||
| Part Removal and Replacement | ||
| Component Packaging | Cut Tape,Tube,Reels,Loose Parts | |
| Turn Time | Same Day Service to 15 day service | |
| Testing | X-RAY Inspection & AOI Test | |
PCB Assembly Technical Capability
We deliver high quality surface-mount technology (SMT) products through the use of modern, well maintained SMT lines that are operated by trained professionals. Our SMT lines are capable of handling both low and high volume through-put, can perform single and double sided component placement, mixture of SMT automatic and manual component assemblies, SMT and through-hole assemblies.
Capability 1.SMT with 3 million placements per day
2.Manual insertion with output 300,000pcs components per day
3.Chip mounting speed is 0.3S/unit,high-point speed is 0.16S/unit
Mount Precision: 1.Chips size:Min.0201
2.Mounting precision:0.1mm
3.Multi-functional machine can match 0.3 pitch packages such as BGA,CSP
Manufacturing Capability for PCB Board
1). Material type: CEM-3,FR-4,FR-4-TG170/TG180,BGA,Buried/blind holes, Bergquist
2). Surface Treatment: HASL,HASL lead-free,HAL,Flash gold,immersion gold,OSP,Gold Finger Palting,Selective thick gold plating, immersion silver,immersion tin, Carbon ink,peelable mask
3). Solder mask colour: Green/MATT Green/Blue/Yello/White/Black/Red
4). Board Size: 650mm*1200mm
5). Board Layer: 1L-16L
6). Board thickness: 0.2mm to 6.0mm
7). Finished Copper thickness: 0.5 OZ to 6 OZ
8). Min. drilled hole size: 3mil (0.075mm)
9). Min. Line width/Line spacing: 3mil/3mil
10). Copper thickness in hole: >20um
11). Board thickness tolerance: ±10%
12). Outline tolerance: Routing:±0.1mm,Punching:±0.1mm
13). Hole tolerance: PTH: ±0.076mm , NPTH: ±0.05mm
14). impedance control tolerance: ±10%
15). Warp and Twist: <0.75%
16). Tested by:Flying-Probe Tester, Fixture tester , Visual Inspection
17). Special requirements: Buried and blind vias, impedance control, thick Cu PCB,selectivity plating gold 30 microinch
18). Profiling: Punching, Routing, V-CUT, Beveling
19). Certificate: UL,ISO 9001,ISO14001,ROHS
20). We have a sound quality management system,Ensure the quality of all products
PCB/PCBA Features:
Dimension: 92.5mm*36mm
Base Material: 0.1mm Cu/25um ADH/25um PI+25um ADH/35um Cu/
20um ADH/ 35um Cu/ 2525um PI+25um ADH/
25um ADH/ 0.1mm Au
Thickness: 1.6mm
Line Width/Space: 0.15mm/0.15mm
Surface Treatment: ENIG: Au: 0.03-0.09um, Ni: 2-6um
Minimum via diameter: 0.2mm
The smallest hole: 0.35mm
Outline Tolerance: +/-0.2mm.