PCB Product Description
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Insulation Materials: Epoxy Resin
Layers: 1-16 Layers
Max. Board Size: 600*1200mm
Min. Line Width/Space: 3mil/3mil Hoz Copper Base(Inner Layer)
Min. Solder Mask Bridge: 3.2mil(Hoz Base Copper, Green)
Min. Blind/Burried Via: 8mil
Origin: Shenzhen, China
Material: Fiberglass Epoxy
Type: Single-sided, doubled sided and multi-layer PCB:CEM-1, FR-4, High TG FR-4, Aluminum base material
Specification: CE, UL, RoHs, SGS
HS Code: 8534009000
Surface treatment: HAL, HASL, HASL Lead Free, Immersion Gold/ Silver/ Tin, OSP
Standard: 94V0 compliant, and adhere to IPC610 Class 2
Test: 100% E-Test
SMT assembly
SMT( Surface Mounting Technology ), COB, DIP
Material source service, one-stop service
IC programming and Burning on-line
Function testing as requested
Packing design
| Factory Manufacture Capability | ||
| NO | ITEM | Techinical capabilities |
| 1 | Min. hole size | 8mil |
| 2 | PTH wall thickness | ≥ 1mil |
| 3 | Hole dia. tolerance | ± 3mil |
| 4 | Hole dia. tolerance | ± 2mil |
| 5 | Countersink hole | Min. depth(D)6mil; The Depth of tolerance± 6mil |
| 6 | Drilling hole positional deviation(outer layer) | 1st-drill ± 3mil(Normal) ± 2mil(min. ) |
| 2nd-drill ± 4mil | ||
| 7 | Min. solder mask bridge | 3.2mil(HOZ base copper, green) |
| 8 | Outline tolerance | ± 4mil |
| 9 | Twist & Bow | ≤ 0.75% |
| 10 | Peelable mask thickness | ≥ 8mil 1 printing |
| 21 | Insulation Resistance | > 1012Ω Normal |
| 12 | Through hole resistance | < 300Ω Normal |
| 13 | Current breakdown | 10A |
| 14 | Peel strength | 1.4N/mm |
| 15 | S/M abrasion | > 6H |
| 16 | Thermal stress | 28 degrees 20Sec |
| 17 | Test Voltage | 20-300V |
| 18 | Min. blind/burried via | 8mil |
| 19 | Surface finish | HAL ENIG IMAG IMSN OSP HAL+G/F ENIG+G/F |
| 20 | Impedance control | Single ended impedance 50Ω /70Ω ± 10% Normal |
| Differential impedance 90Ω /100Ω ± 10% Normal | ||
| 21 | Max. aspect ratio | 12: 1 |