New development projects require more complex, larger PCBA and tighter packaging. These requirements challenge our ability to build and test these units. Further, larger boards with smaller components and higher nodes may continue. For example, a design of a circuit board diagram is now being painted with approximately 116,000 nodes, more than 5,100 components and more than 37,800 solder joints requiring test or confirmation. This unit also has BGA on the top and bottom face, BGA is immediately followed. Using traditional needle beds to test the size and complexity of the plates, an ICT approach is impossible.
In the manufacturing process, especially in testing, the increasing PCBA complexity and density are not a new problem. Aware of increasing the number of test pins within the ICT test fixture is not the direction to go, we begin to observe the alternative circuit confirmation method. See the number of probes that are not exposed to each million, we find that at 5,000 nodes, many of the bugs found (less than 31) may be due to the probe contact problem rather than the actual manufacturing defect (table 1). Therefore, we proceed to reduce the number of test needles, not to rise. Nonetheless, the quality of our manufacturing process is assessed to the entire PCBA. We decided to use the traditional ICT and X-ray layering method to be a viable solution.