| Item | Standard | Limitation |
| Material | CEM-1, CEM-3,FR4（halogen-free） | high frequency series |
| Layer | 2 -- 12 | 16 |
| Max size | 580 * 620 | 580 *900 |
| Finished Board Thickness(T) | 0.4 - 3.5 | 0.3 - 5.4 |
| 0.4≤T≤0.8,tolerance +/-0.085 | |
| 0.8≤T≤1.0,tolerance +/-0.1 | |
| T≤1.0mm,tolerance +/-10% | |
| Copper Weight | 0.5OZ -- 3OZ | 5OZ |
| Warpage | 0.75%（Max） | 0.50% |
| 1.2% (Max) | 1.00% |
| Impedance Tolerance | natural impedance：+/-10% | natural impedance：+/-8% |
| differential impedance：+/-10% | differential impedance：+/-8% |
| Surface Treatment | LF HASL、ENIG、OSP、Immersion tin | Hybrid surface treatment |
Line Width/
Line Space | ≧0.5OZ，3mil/3mil | 2.5mil/2.5mil |
| ≧1OZ，5mil/5mil | 4mil/4mil |
| ≧2OZ，7mil/7mil | 5mil/5mil |
| ≧3OZ，9mil/9mil | 8mil/8mil |
| ≧4OZ，11mil/11mil | 10mil/10mil |
| Min Hole Diameter | 0.2mm | 0.15mm |
| Max Hole Diameter | 6.5mm | |
| Hole Copper Thickness | 12um -- 25um | Max 50um |
| Solder Mask | green, black, white, blue | yellow, coffee |
| S/M thickness | line/copper surface：12um-25um | 10um-28um |
| line angle：5um-15um | 10um-25um |
| base material position：18um-35um | 35um-35um |
| Min S/M Bridge | base copper thickness≤H/Hoz，2.5mil | |
| base copper thickness≤1/1oz，3.5mil | |
| base copper thickness≤2/2oz，1mil | |
| base copper thickness≤3/3oz，5.0mil | |
| Legend | min width：10mil | |
| Min height：30mil | |
| min legend s/m bridge：6mil | |
| 碳油 | min width 14mil | 12mil |
| LF HASL Thickess | 0.8um-40um | 2.5um-40um |
| ENIG Thickness | nickel thickness：2.54um≤max≤5um | |
| gold thickness：0.025um≤max≤0.05um | |
| V-cut slot | board thickness： 0.4mm≤max≤3.0mm | 0.2mm≤max≤5.0mm |
| Package | EPE foam &vacuum packing | vacuum package bags |
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| PS | Please send drawing files or call us for other special request. |
