Item | Standard | Limitation |
Material | CEM-1, CEM-3,FR4(halogen-free) | high frequency series |
Layer | 2 -- 12 | 16 |
Max size | 580 * 620 | 580 *900 |
Finished Board Thickness(T) | 0.4 - 3.5 | 0.3 - 5.4 |
0.4≤T≤0.8,tolerance +/-0.085 | |
0.8≤T≤1.0,tolerance +/-0.1 | |
T≤1.0mm,tolerance +/-10% | |
Copper Weight | 0.5OZ -- 3OZ | 5OZ |
Warpage | 0.75%(Max) | 0.50% |
1.2% (Max) | 1.00% |
Impedance Tolerance | natural impedance:+/-10% | natural impedance:+/-8% |
differential impedance:+/-10% | differential impedance:+/-8% |
Surface Treatment | LF HASL、ENIG、OSP、Immersion tin | Hybrid surface treatment |
Line Width/
Line Space | ≧0.5OZ,3mil/3mil | 2.5mil/2.5mil |
≧1OZ,5mil/5mil | 4mil/4mil |
≧2OZ,7mil/7mil | 5mil/5mil |
≧3OZ,9mil/9mil | 8mil/8mil |
≧4OZ,11mil/11mil | 10mil/10mil |
Min Hole Diameter | 0.2mm | 0.15mm |
Max Hole Diameter | 6.5mm | |
Hole Copper Thickness | 12um -- 25um | Max 50um |
Solder Mask | green, black, white, blue | yellow, coffee |
S/M thickness | line/copper surface:12um-25um | 10um-28um |
line angle:5um-15um | 10um-25um |
base material position:18um-35um | 35um-35um |
Min S/M Bridge | base copper thickness≤H/Hoz,2.5mil | |
base copper thickness≤1/1oz,3.5mil | |
base copper thickness≤2/2oz,1mil | |
base copper thickness≤3/3oz,5.0mil | |
Legend | min width:10mil | |
Min height:30mil | |
min legend s/m bridge:6mil | |
碳油 | min width 14mil | 12mil |
LF HASL Thickess | 0.8um-40um | 2.5um-40um |
ENIG Thickness | nickel thickness:2.54um≤max≤5um | |
gold thickness:0.025um≤max≤0.05um | |
V-cut slot | board thickness: 0.4mm≤max≤3.0mm | 0.2mm≤max≤5.0mm |
Package | EPE foam &vacuum packing | vacuum package bags |
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PS | Please send drawing files or call us for other special request. |